RT9030-25GQW Ver la hoja de datos (PDF) - Richtek Technology
Número de pieza
componentes Descripción
Fabricante
RT9030-25GQW
Richtek Technology
RT9030-25GQW Datasheet PDF : 10 Pages
| |||
RT9030
designer to see the effect of rising ambient temperature
on the maximum power allowed.
0.8
0.7
WDFN-6L 1.6x1.6
0.6
Single Layer PCB
0.5
0.4
SC-70-5
0.3
0.2
0.1
0
0
25
50
75
100
125
Ambient Temperature (°C)
Figure 3. Derating Curve of Maximum Power Dissipation
Layout Considerations
Careful PCB Layout is necessary for better performance.
The following guidelines should be followed for good PCB
layout.
Place the input and output capacitors as close as
possible to the IC.
Keep VIN and VOUT trace as possible as short and wide.
Use a large PCB ground plane for maximum thermal
dissipation.
CIN should be placed as close
as possible to VIN pin for good
filtering.
VIN
VIN 1
CIN
GND 2
COUT should be placed as close
as possible to VOUT pin for good
filtering.
VOUT
5 VOUT
COUT
EN 3 4 NC
GND
The through hole of the GND pin is
recommended to be as many as possible.
Figure 4
Copyright ©2013 Richtek Technology Corporation. All rights reserved.
www.richtek.com
8
is a registered trademark of Richtek Technology Corporation.
DS9030-04 December 2013
Share Link: 