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74HC2G126DP(2013) Ver la hoja de datos (PDF) - NXP Semiconductors.

Número de pieza
componentes Descripción
Fabricante
74HC2G126DP
(Rev.:2013)
NXP
NXP Semiconductors. 
74HC2G126DP Datasheet PDF : 15 Pages
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NXP Semiconductors
74HC2G126; 74HCT2G126
Dual buffer/line driver; 3-state
VSSOP8: plastic very thin shrink small outline package; 8 leads; body width 2.3 mm
SOT765-1
D
y
Z
8
5
pin 1 index
E
c
HE
A A2
A1
1
e
4
bp
wM
detail X
A
X
vM A
Q
(A3)
θ
Lp
L
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D(1) E(2)
e
HE
mm
1
0.15
0.00
0.85
0.60
0.12
0.27
0.17
0.23
0.08
2.1
1.9
2.4
2.2
0.5
3.2
3.0
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC
SOT765-1
REFERENCES
JEDEC
JEITA
MO-187
L
Lp
Q
v
w
y
Z(1)
θ
0.4
0.40 0.21
0.15 0.19
0.2
0.13
0.1
0.4
0.1
8°
0°
EUROPEAN
PROJECTION
ISSUE DATE
02-06-07
Fig 10. Package outline SOT765-1 (VSSOP8)
74HC_HCT2G126
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 18 December 2013
© NXP B.V. 2013. All rights reserved.
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