AD9726
OUTLINE DIMENSION
1.20
0.75 MAX
0.60
0.45
SEATING
PLANE
14.00 SQ
12.00 SQ
80
1
PIN 1
TOP VIEW
(PINS DOWN)
61
60
61
60
Preliminary Technical Data
80
1
BOTTOM
6.00
VIEW
SQ
0.15
0.05
0.20
0.09
20
21
1.05
1.00
0.95
COPLANARITY
0.08
0.50 BSC
41
40
41
40
7°
3.5°
0°
0.27
GAGE PLANE
0.22
0.25
0.17
COMPLIANT TO JEDEC STANDARDS MS-026-ADD-HD
Figure 13. 80-Lead Thin Plastic Quad Flat Package, Exposed Pad [TQFP/ED]
(SV-80)
Dimensions shown in millimeters
20
21
ORDERING GUIDE
Model
Temperature Range
AD9726BSV
-40°C to +85°C
Package Description
80 Lead TQFP
Package Option
SV-80
THERMAL CHARACTERISTICS
Thermal Resistance
80-Lead Thermally Enhanced
TQFP Package θJA = 23.5°C/W*
*With thermal pad soldered to PCB.
© 2004 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
PR04540-0-1/04(PrD)
Rev. PrD | Page 16 of 16