Data Sheet
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter
VDDA
VDD33
VDD
VDDC
VSSA
VSSA
VSS
DACCLK_P, DACCLK_N
DCI, DCO, SYNC_IN,
SYNC_OUT
LVDS Data Inputs
IOUTP, IOUTN
I120, VREF
IRQ, CS, SCLK, SDO,
SDIO, RESET
Junction Temperature
Storage Temperature
With
Respect To
VSSA
VSS
VSS
VSSC
VSS
VSSC
VSSC
VSSC
VSS
VSS
VSSA
VSSA
VSS
Rating
−0.3 V to +3.6 V
−0.3 V to +3.6 V
−0.3 V to +1.98 V
−0.3 V to +1.98 V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−0.3 V to VDDC + 0.18 V
−0.3 V to VDD33 + 0.3 V
−0.3 V to VDD33 + 0.3 V
−1.0 V to VDDA + 0.3 V
−0.3 V to VDDA + 0.3 V
−0.3 V to VDD33 + 0.3 V
150°C
−65°C to +150°C
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
AD9739
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 6. Thermal Resistance
Package Type
160-Ball CSP_BGA
θJA
θJC
31.2
7.0
1 With no airflow movement.
ESD CAUTION
Unit
°C/W1
Rev. E | Page 9 of 50