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ADP2386(RevA) Ver la hoja de datos (PDF) - Analog Devices

Número de pieza
componentes Descripción
Fabricante
ADP2386
(Rev.:RevA)
ADI
Analog Devices 
ADP2386 Datasheet PDF : 24 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
Data Sheet
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
PVIN, EN, PGOOD
SW
BST
FB, SS, COMP, SYNC, RT
VREG
PGND to GND
Operating Junction Temperature Range
Storage Temperature Range
Soldering Conditions
Rating
−0.3 V to +22 V
−1 V to +22 V
VSW + 6 V
−0.3 V to +6 V
−0.3 V to +12 V
−0.3 V to +0.3 V
−40°C to +125°C
−65°C to +150°C
JEDEC J-STD-020
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ADP2386
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a 4-layer, JEDEC standard circuit board for surface-
mount packages.
Table 3. Thermal Resistance
Package Type
θJA
24-Lead LFCSP_WQ
42.6
Unit
°C/W
ESD CAUTION
Rev. A | Page 5 of 24

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