AP2176 Ver la hoja de datos (PDF) - Diodes Incorporated.
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AP2176 Datasheet PDF : 17 Pages
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AP2166/ AP2176
Electrical Characteristics (@TA = +25°C, CIN = 10µF, VIN = +5V, unless otherwise specified.)
Symbol
Parameter
Test Conditions
Min Typ Max Unit
VUVLO Input UVLO
RLOAD = 1kΩ
1.6 1.9 2.5 V
ISHDN Input Shutdown Current
Disabled, IOUT = 0
- 0.5 1 µA
IQ
Input Quiescent Current, Dual
Enabled, IOUT = 0
-
95 140 µA
ILEAK Input Leakage Current
Disabled, OUT grounded
-
-
1 µA
IREV Reverse Leakage Current
RDS(ON) Switch On-Resistance
Disabled, VIN = 0V, VOUT = 5V, IREV at VIN
VIN = 5V, IOUT = 1A, -40°C ≤ TA ≤ +85°C
VIN = 3.3V, IOUT = 1A, -40°C ≤ TA ≤ +85°C
MSOP-8EP
SO-8
-
1
- µA
-
90 135 mΩ
- 100 135 mΩ
- 120 160 mΩ
ISHORT Short-Circuit Current Limit
Enabled into short circuit, CL = 68µF
-
1.5
-
A
ILIMIT Overload Current Limit
VIN = 5V, VOUT = 4.8V, CL = 120µF, -40°C ≤ TA ≤ +85°C
1.1 1.5 1.9 A
ITrig Current Limiting Trigger Threshold
VIN = VEN, Output Current Slew rate (<100A/WS), CL = 68µF
-
2.0
-
A
TSHORT Short-Circuit Response Time
VOUT = 0V to IOUT = ILIMIT (short applied to output), CL = 68µF -
20
- µs
VIL
EN Input Logic Low Voltage
VIN = 2.7V to 5.5V
-
- 0.8 V
VIH EN Input Logic High Voltage
VIN = 2.7V to 5.5V
2
-
-
V
ISINK EN Input Leakage
VEN = 5V
-
-
1 µA
TD(ON) Output Turn-on Delay Time
CL=1µF, RLOAD = 10Ω
- 0.05 - ms
TR
Output Turn-on Rise Time
CL=1µF, RLOAD = 10Ω
- 0.6 1.5 ms
TD(OFF) Output Turn-off Delay Time
CL=1µF, RLOAD = 10Ω
- 0.01 - ms
TF
Output Turn-off Fall Time
CL=1µF, RLOAD = 10Ω
- 0.05 0.1 ms
RFLG FLG Output FET on-Resistance
IFLG =10mA
-
20 40 Ω
IFOH Error Flag Iff Current
VFLG = 5V
- 0.01 1 µA
TBlank FLG Blanking Time
CL = 68µF
4
7 15 ms
TSHDN Thermal Shutdown Threshold
Enabled, RLOAD = 1kΩ
- +140 - C
THYS
θJA
Thermal Shutdown Hysteresis
-
SO-8 (Note 5)
Thermal Resistance Junction-to-Ambient
MSOP-8EP (Note 6)
- +25 - C
- 110 - °C/W
-
60
- °C/W
Notes:
5. Test condition for SO-8: Device mounted on FR-4 2-layer board, 2oz. copper, with minimum recommended pad layout.
6. Test condition for MSOP-8EP: Device mounted on FR-4 2-layer board, 2oz. copper, with minimum recommended pad on top layer and 3 vias to bottom
layer ground plane.
AP2166/ AP2176
Document number: DS31814 Rev. 4 - 2
4 of 17
www.diodes.com
May 2016
© Diodes Incorporated
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