APL5101/2
Classification Reflow Profiles (Cont.)
Table 1. SnPb Entectic Process – Package Peak Reflow Temperatures
Package Thickness
Volume mm3
Volume mm3
<350
≥350
<2.5 mm
240 +0/-5°C
225 +0/-5°C
≥2.5 mm
225 +0/-5°C
225 +0/-5°C
Table 2. Pb-free Process – Package Classification Reflow Temperatures
Package Thickness
Volume mm3
Volume mm3
Volume mm3
<350
350-2000
>2000
<1.6 mm
260 +0°C*
260 +0°C*
260 +0°C*
1.6 mm – 2.5 mm
260 +0°C*
250 +0°C*
245 +0°C*
≥2.5 mm
250 +0°C*
245 +0°C*
245 +0°C*
*Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the
stated classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C)
at the rated MSL level.
Reliability test program
Test item
SOLDERABILITY
H O LT
PCT
TST
ESD
Latch-Up
Method
M IL-STD-883D-2003
M IL-STD-883D-1005.7
JESD-22-B, A102
M IL-STD-883D-1011.9
M IL-STD-883D-3015.7
JESD 78
Carrier Tape
E
Po
P
P1
Description
245°C , 5 SEC
1000 Hrs Bias @ 125 °C
168 Hrs, 100 % RH , 121°C
-65°C ~ 150°C, 200 Cycles
VHBM > 2KV, VMM > 200V
1 0 m s , Itr > 1 0 0 m A
t
D
F
Bo
W
Ao
D1
J
C
A
Ko
T2
B
Copyright © ANPEC Electronics Corp.
14
Rev. A.1 - Jun., 2005
T1
www.anpec.com.tw