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AS8221-ASST Ver la hoja de datos (PDF) - austriamicrosystems AG

Número de pieza
componentes Descripción
Fabricante
AS8221-ASST
AmsAG
austriamicrosystems AG 
AS8221-ASST Datasheet PDF : 43 Pages
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AS8221
Data Sheet - Absolute Maximum Ratings
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only. Functional operation of the
device at these or any other conditions beyond those indicated in Section 6 Electrical Characteristics on page 8 is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Table 2. Absolute Maximum Ratings
Parameter
Min
Max
Units
Notes
Battery Supply Voltage (VBAT)
-0.3
+50
V
Supply Voltage (VCC)
-0.3
+7.0
V
Supply Voltage (VIO)
-0.3
+7.0
V
DC Voltage at EN, STBN, ERRN, TxD, RxD,
TxEN, BGE, RxEN
-0.3
VIO + 0.3
V
VIO < VCC
DC Voltage on pin WAKE, INH1, INH2
-0.3 VBAT + 0.3
DC Voltage at BP and BM
-40
+50
V
Input current (latchup immunity)
-100
100
mA
According to JEDEC 78
Electrostatic discharge at bus lines BP, BM,
VBAT, WAKE
-4
+4
kV
According to AEC-Q100-002
Electrostatic discharge
-2
+2
kV
According to AEC-Q100-002
Transient voltage on BP, BM
-200
+200
According to ISO7637 part3 test pulses a and b;
V
class C; RL=45 Ω, CL= 100 pF; (see Figure 18
on page 33).
-200
+200
According to ISO7637 part2 test pulses 1, 2, 3a
V
and 3b; class C; RL=45 Ω, CL= 100 pF; (see
Figure 18 on page 33).
Transient voltage on VBAT
+6.5
+50
According to ISO7637 part2 test pulse 4; class C;
V
RL=45 Ω, CL= 100 pF; (see Figure 18 on page
33).
According to ISO7637 part2 test pulse 5b; class
+50
C; RL=45 Ω, CL= 100 pF; (see Figure 18 on
page 33).
Total power dissipation (all supplies and outputs)
150
mW
Storage temperature
-55
+150
ºC
Junction temperature
-40
+150
ºC
Package body temperature1
250
ºC
Humidity non-condensing
5
85
%
1. The reflow peak soldering temperature (body temperature) specified is in accordance with IPC/JEDEC J-STD-020C “Moisture/Reflow
Sensitivity Classification for Non-Hermetic Solid State Surface Mount Devices”. The lead finish for Pb-free leaded packages is matte tin
(100% Sn).
www.austriamicrosystems.com/flexray/AS8221
Revision 1.1
7 - 43

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