Philips Semiconductors
N-channel dual-gate MOS-FETs
Product specification
BF1212; BF1212R; BF1212WR
CAUTION
This product is supplied in anti-static packing to prevent damage caused by electrostatic discharge during transport
and handling. For further information, refer to Philips specs.: SNW-EQ-608, SNW-FQ-302A and SNW-FQ-302B.
ORDERING INFORMATION
TYPE NUMBER
BF1212
BF1212R
BF1212WR
NAME
−
−
−
PACKAGE
DESCRIPTION
plastic surface mounted package; 4 leads
plastic surface mounted package; reverse pinning; 4 leads
plastic surface mounted package; reverse pinning; 4 leads
VERSION
SOT143B
SOT143R
SOT343R
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL
PARAMETER
CONDITIONS
VDS
drain-source voltage
ID
drain current (DC)
IG1
gate 1 current
IG2
gate 2 current
Ptot
total power dissipation
BF1212; BF1212R
BF1212WR
Tstg
storage temperature
Tj
junction temperature
Ts ≤ 116 °C; note 1
Ts ≤ 122 °C; note 1
Note
1. Ts is the temperature of the soldering point of the source lead.
MIN.
−
−
−
−
MAX.
6
30
±10
±10
UNIT
V
mA
mA
mA
−
180
mW
−
180
mW
−65
+150
°C
−
150
°C
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
Rth j-s
thermal resistance from junction to soldering point
BF1212; BF1212R
BF1212WR
VALUE
185
155
UNIT
K/W
K/W
2003 Nov 14
3