BUJ302AD Ver la hoja de datos (PDF) - Philips Electronics
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BUJ302AD Datasheet PDF : 14 Pages
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NXP Semiconductors
7. Package outline
Plastic single-ended surface-mounted package (DPAK); 3 leads (one lead cropped)
BUJ302AD
NPN power transistor
SOT428
E
A
b2
y
A
A1
D1
HD
mounting
base
L2
b1
2
1
L
3
b
e
e1
wM A
L1
c
E1
D2
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT A
A1
b
b1
b2
c
D1
D2
min
E
E1
min
e
e1
HD
L
L1
min
L2
mm
2.38
2.22
0.93
0.46
0.89
0.71
1.1
0.9
5.46 0.56 6.22
5.00 0.20 5.98
4.0
6.73
6.47
4.45 2.285 4.57
10.4
9.6
2.95
2.55
0.5
0.9
0.5
w
y
max
0.2 0.2
OUTLINE
VERSION
IEC
SOT428
REFERENCES
JEDEC
JEITA
TO-252
SC-63
Fig 15. Package outline SOT428 (DPAK)
EUROPEAN
PROJECTION
ISSUE DATE
06-02-14
06-03-16
BUJ302AD
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 28 March 2011
© NXP B.V. 2011. All rights reserved.
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