RF1K4909296 Ver la hoja de datos (PDF) - Fairchild Semiconductor

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Fabricante

RF1K4909296

3.5A/2.5A, 12V, 0.050/0.130 Ohm, Logic Level, Complementary LittleFET™ Power MOSFET

Fairchild Semiconductor 

RF1K49092

Soldering Precautions

1. The soldering process creates a considerable thermal

stress on any semiconductor component. The melting

temperature of solder is higher than the maximum rated

temperature of the device. The amount of time the device

is heated to a high temperature should be minimized to

assure device reliability. Therefore, the following precau-

tions should always be observed in order to minimize the

thermal stress to which the devices are subjected.

2. Always preheat the device.

3. The delta temperature between the preheat and soldering

should always be less than 100oC. Failure to preheat the

device can result in excessive thermal stress which can

damage the device.

4. The maximum temperature gradient should be less than 5oC

per second when changing from preheating to soldering.

5. The peak temperature in the soldering process should be

at least 30oC higher than the melting point of the solder

chosen.

6. The maximum soldering temperature and time must not

exceed 260oC for 10 seconds on the leads and case of

the device.

7. After soldering is complete, the device should be allowed

to cool naturally for at least three minutes, as forced cool-

ing will increase the temperature gradient and may result

in latent failure due to mechanical stress.

8. During cooling, mechanical stress or shock should be

avoided.

©2002 Fairchild Semiconductor Corporation

RF1K49092 Rev. B

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