CXP82840 Ver la hoja de datos (PDF) - Sony Semiconductor

Número de pieza

componentes Descripción

Fabricante

CXP82840

CMOS 8-bit Single Chip Microcomputer

Sony Semiconductor 

Package Outline

Unit: mm

100PIN QFP (PLASTIC)

23.9 ± 0.4

+ 0.4

20.0 – 0.1

+ 0.1

0.15 – 0.05

CXP82832/82840/82852/82860

0.65

±0.12 M

0.15

A

+ 0.35

2.75 – 0.15

0° to 15°

DETAIL A

SONY CODE

EIAJ CODE

JEDEC CODE

QFP-100P-L01

∗QFP100-P-1420-A

PACKAGE STRUCTURE

PACKAGE MATERIAL

LEAD TREATMENT

EPOXY RESIN

SOLDER PLATING

LEAD MATERIAL

PACKAGE WEIGHT

COPPER / 42 ALLOY

1.4g

– 22 –

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