EL1508CL Ver la hoja de datos (PDF) - Intersil
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EL1508CL Datasheet PDF : 18 Pages
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EL1508
Typical Performance Curves (Continued)
21.6
25
21.4
21
21.2
17
VS=±12V
RFB=10
AV=10
RL=100Ω
21.0
20.8
20.6
50
FREQ=100kHz
VS=±12V
RSET=0
AV=10
70 90 110 130 150 170 190
DIFFERENTIAL LOAD RESISTANCE (Ω)
FIGURE 37. LOAD RESISTANCE vs OUTPUT VOLTAGE
(ALL POWER MODES)
13
9
5
0
2
4
6
8
10
RADJ (kΩ)
FIGURE 38. IS+ vs RADJ (FULL POWER MODE)
30
25
FULL POWER
+
-
20
15
2/3 POWER
+
-
10
1/3 POWER
+
-
5
0
0
2
4
6
8
10
12
SUPPLY VOLTAGE (V)
FIGURE 39. SUPPLY CURRENT vs SUPPLY VOLTAGE
4.5
4.0
θJA = 30°C/W
3.5
3.0
2.5
θJA = 43°C/W
2.0
θJA = 53°C/W
1.5
1.0
θJA = 80°C/W
0.5
0
-40 -20 0 20 40 60 80 100
AMBIENT TEMPERATURE (°C)
FIGURE 40. POWER DISSIPATION vs AMBIENT
TEMPERATURE for VARIOUS MOUNTED θJAs
(See Thermal Resistance Curve on page 15)
USING ELANTEC EL1503CS DEMO BOARD, 2”X2”
(4-LAYER). DEMO BOARD WITH HEATSINK VIA
INTERNAL GROUND PLANE
4
3.5
3
2.5
2
θJA =47°C/W
1.5
1
0.5
0
-40 -20 0
20 40 60 80 100
AMBIENT TEMPERATURE (°C)
FIGURE 41. 16 LD SOIC POWER DISSIPATION and THERMAL
RESISTANCE
USING JEDEC JESD51-3 HIGH EFFECTIVE THERMAL
CONDUCTIVITY. (4-LAYER) TEST BOARD, QFN
EXPOSED DIEPAD SOLDERED TO PCB PER JESD51-5
4.0
3.5
3.0 3.378W
2.5
2.0
θJA =37°C/W
1.5
1.0
0.5
0
0
25
50
75 85 100 125 150
AMBIENT TEMPERATURE (°C)
FIGURE 42. 24 LD QFN POWER DISSIPATION vs AMBIENT
TEMPERATURE
12
FN7014.5
March 26, 2007
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