AD14060 Ver la hoja de datos (PDF) - Analog Devices

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AD14060

Quad-SHARC® DSP Multiprocessor Family

Analog Devices 

Thermal Characteristics

The AD14060/AD14060L is packaged in a 308-lead ceramic

quad flatpack (CQFP). The package is optimized for thermal

conduction through the core (base of the package) down to the

mounting surface. The AD14060/AD14060L is specified for a

case temperature (TCASE). Design of the mounting surface and

attachment material should be such that TCASE is not exceeded.

θJC = 0.36°C/W

Thermal Cross-Section

The data below, together with the detailed mechanical drawings

at the end of the data sheet, allows for constructing simple ther-

mal models for further analysis within targeted systems. The top

layer of the package, where the die are mounted, is a metal VDD

layer. The approximate metal area coverage from the metal

planes and routing layers is estimated below.

AD14060/AD14060L

Thermal Conductivity

Material

Ceramic

Kovar

Tungsten

Thermoplastic

Silicon

Thermal Conductivity

W/cm؇C

0.18

0.14

1.78

0.03

1.45

Layer

VDD

SIG2

SIG3

GND

SIG4

SIG5

BASE

Metal Coverage Per Layer

Percent Metal

(1 Mil Thick)

88

16

14

91

15

13

95

KOVAR LID

0.015 MILS

KOVAR SEAL RING

HEIGHT = 50 MILS

SILICON DIE

19 MILS

THERMOPLASTIC

THICKNESS 5 MILS

VDD

SIG2

SIG3

GND

SIG4

SIG5

BASE

SURFACE

CERAMIC LAYER 28 MILS

CERAMIC LAYER 6 MILS

CERAMIC LAYER 6 MILS

CERAMIC LAYER 10 MILS

CERAMIC LAYER 4 MILS

CERAMIC LAYER 10 MILS

CERAMIC LAYER 10 MILS

CERAMIC LAYER 4 MILS

CERAMIC LAYER 10 MILS

CERAMIC LAYER 4 MILS

REV. A

–41–

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