HPL1117-25FC-TU Ver la hoja de datos (PDF) - Unspecified

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Fabricante

HPL1117-25FC-TU

1A Low Dropout Fast Response Positive Adjustable Regulator and Fixed 1.8V, 2.5V, 2.85V, 3.3V and 5V

Unspecified 

HPL1117

Application Information (Cont.)

Thermal Considerations (Cont.)

60

TA=25°C

55

50

45

40

35

30

0

2

4

6

8

10 12 14

Top Copper Area (cm2)

Figure 4.

θ(J-A) vs. copper area for the SOT-223 package

The thermal resistance for each application will be

affected by thermal interactions with other compo-

nents on the board. Some experimentation will be

necessary to determine the actual value.

The power dissipation of HPL1117 is equal to :

PD = (VIN - VOUT) x IOUT

Maximum junction temperature is equal to :

TJUNCTION = TAMBIENT + (PD x θJA)

Note: TJUNCTION must not exceed 125°C

 Copyright HIPAC Semiconductor, Inc.

12

Rev. B.13 - Mar., 2004

www.hipacsemi.com

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