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ISP1109BS Datasheet PDF : 59 Pages
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Philips Semiconductors
ISP1109
USB transceiver with carkit support
[4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
[5] If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[6] Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[7] Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[8] Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
[9] Hot bar soldering or manual soldering is suitable for PMFP packages.
20. Abbreviations
Table 64: Abbreviations
Acronym
Description
ATX
Analog USB transceiver
DC
Direct Current
ESD
Electro-Static Discharge
I2C-bus
Inter IC-bus
LSB
Least Significant Bit
MIC
Microphone
MSB
Most Significant Bit
OTG
On-The-Go
POR
Power-On Reset
PORP
Power-On Reset Pulse
RxD
Receive Data
SE1
Single-Ended One
SoC
System-on-a-Chip
SPI
Serial Parallel Interface
SRP
Session Request Protocol
TxD
Transmit Data
UART
Universal Asynchronous Receiver-Transmitter
USB
Universal Serial Bus
21. References
[1] Universal Serial Bus Specification Rev. 2.0
[2] CEA−936−A, Mini-USB Analog Carkit Interface
[3] The I2C-bus Specification; Version 2.1
[4] ECN_27%_ Resistor (http://www.usb.org/developers/docs).
9397 750 13355
Product data sheet
Rev. 01 — 14 July 2005
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
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