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K4B1G0446G-BCH9 Ver la hoja de datos (PDF) - Samsung

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K4B1G0446G-BCH9 Datasheet PDF : 64 Pages
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K4B1G0446G
K4B1G0846G
datasheet
Rev. 1.01
DDR3 SDRAM
NOTE :
1. The tolerance limits are specified after calibration with stable voltage and temperature. For the behavior of the tolerance limits if temperature or voltage changes after calibra-
tion, see following section on voltage and temperature sensitivity
2. The tolerance limits are specified under the condition that VDDQ = VDD and that VSSQ = VSS
3. Pull-down and pull-up ODT resistors are recommended to be calibrated at 0.5XVDDQ. Other calibration schemes may be used to achieve the linearity spec shown above, e.g.
calibration at 0.2XVDDQ and 0.8XVDDQ.
4. Not a specification requirement, but a design guide line
5. Measurement definition for RTT:
Apply VIH(AC) to pin under test and measure current I(VIH(AC)), then apply VIL(AC) to pin under test and measure current I(VIL(AC)) respectively
RTT =
VIH(AC) - VIL(AC)
I(VIH(AC)) - I(VIL(AC))
6. Measurement definition for VM and VM : Measure voltage (VM) at test pin (midpoint) with no load
VM =
2 x VM - 1 x 100
VDDQ
9.8.2 ODT Temperature and Voltage sensitivity
If temperature and/or voltage change after calibration, the tolerance limits widen according to table below
T = T - T(@calibration); V = VDDQ - VDDQ (@calibration); VDD = VDDQ
[ Table 26 ] ODT Sensitivity Definition
RTT
Min
0.9 - dRTTdT * |T| - dRTTdV * |V|
Max
1.6 + dRTTdT * |T| + dRTTdV * |V|
[ Table 27 ] ODT Voltage and Temperature Sensitivity
Min
dRTTdT
0
dRTTdV
0
NOTE : These parameters may not be subject to production test. They are verified by design and characterization.
Max
1.5
0.15
Units
RZQ/2,4,6,8,12
Units
%/°C
%/mV
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