MCS@ 51 CONTROLLER
PACKAGES
Part
8051AH
8031 AH
8052AH
8032AH
6752BH*
8751 H
8751 H-8
8051AHP
8751 BH
Prefix
P
D
N
D
P
D
P
N
Package Type
40-Pin Plastic DIP
40-Pin CERDIP
44-Pin PLCC
40-Pin CERDIP
40-Pin Plastic DIP
40-Pin CERDIP
40-Pin Plastic DIP
44-Pin PLCC
âja
45°chV
4!5âCIW
46°C/W
45âCIW
45âCIW
45°c/w
36âCIW
47âC1W
Ojc
16âC/W
15âCAIV
18°CfW
45âCIW
16°Cf W
15âcf w
12°cf w
16âCf W
NOTE:
*8752BHis 36â/10â for D, and 38â/22â for N.
All thermal impedance data is approximate for static air conditions at IW of power dissipation. Values will
change depending on operating conditions and application. See the Intel Pac/raging Handbook (Order Number
240800) for a description of Intelâs thermal impedance test methodology.
~â52â80320NLâ ~
L { Iâ__âll T2 PI.â
1
T2EX P1.1 2
P1.2 3
P1.3 4
P1.4 5
P1.5 6
P1,6 7
40 Vcc
39 Pâ,â ADO
38 PO.1AD1
37 PO.2A02
36 PO.3 A03
35 PO.4AD4
34 PO.5AD5
PI.6 ::8:;
P1.7 6
33 P06 ADâ
â1RST 9
RU2 P3.O 10
TXD P3.1 11
INTO P3.2 12
INT1 P3,3 13
TOP3 4 14
11 P3.5 15
~ P3.6 16
t% P3.7 17
3 PO.7A07
3 EIJvppâ
Z ALEIPROGâ
29 3%FFI
26 3 P2.7 A15
27 2 P2.6A14
26 3 P2.5 A13
25 I P2.4 A12
24 1 P2.3 Al 1
XTAL2 16
23 > P2.2 AlO
P*,7 .:,.:
RST io;
(Rxo) P3.O :ji:
neaslvsd** .1:;
fTXD) P3.1 :ji;
(INTo) P3.2 :!;;
(INT1) P3.3 :j:;
fTo) P3.4 :>!:
8X5X
+!-- XTAL1 19
âss
22 3 P2 1 A9
21 X P20 A8
DIP
qEPROM only
â*Do not connect reserved pins.
PLCC
Figure 2. MCS@51 Controller Connections
272318-2
3