LPC178X(2011) Ver la hoja de datos (PDF) - NXP Semiconductors.

Número de pieza

componentes Descripción

Fabricante

LPC178X
(Rev.:2011)

32-bit ARM Cortex-M3 microcontroller; up to 512 kB flash and 96 kB SRAM; USB Device/Host/OTG; Ethernet; LCD; EMC

NXP Semiconductors. 

NXP Semiconductors

16. Soldering

Footprint information for reflow soldering of LQFP208 package

LPC178x/7x

32-bit ARM Cortex-M3 microcontroller

SOT459-1

Hx

Gx

P2

P1

(0.125)

Hy Gy

By Ay

C

solder land

occupied area

D2 (8×)

D1

Bx

Ax

Generic footprint pattern

Refer to the package outline drawing for actual layout

DIMENSIONS in mm

P1

P2 Ax

Ay

Bx

By

C

D1 D2 Gx Gy Hx Hy

0.500 0.560 31.300 31.300 28.300 28.300 1.500 0.280 0.400 28.500 28.500 31.550 31.550

Fig 46. Reflow soldering of the LQFP208 package

LPC178X_7X

Objective data sheet

All information provided in this document is subject to legal disclaimers.

Rev. 2 — 27 May 2011

sot459-1_fr

© NXP B.V. 2011. All rights reserved.

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