LT1739 Ver la hoja de datos (PDF) - Linear Technology

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componentes Descripción

Fabricante

LT1739

Dual 500mA, 200MHz xDSL Line Driver Amplifier

Linear Technology 

LT1739

APPLICATIO S I FOR ATIO

When PCB cards containing multiple ports are inserted

into a rack in an enclosed cabinet, it is often necessary to

provide airflow through the cabinet and over the cards. As

seen in the graph of Figure 8, this is also very effective in

further reducing the junction-to-ambient thermal resis-

tance of each line driver.

STILL AIR θJA

TSSOP

100°C/W

PACKAGE

TOP LAYER

2ND LAYER

3RD LAYER

BOTTOM LAYER

TSSOP

50°C/W

TSSOP

45°C/W

DFN

130°C/W

DFN

75°C/W

1739 F08a

Typical Reduction in θJA with

Laminar Airflow Over the Device

0

% REDUCTION RELATIVE

TO θJA IN STILL AIR

–10

– 20

– 30

– 40

– 50

–60

0 100 200 300 400 500 600 700 800 900 1000

AIRFLOW (LINEAR FEET PER MINUTE, lfpm)

1739 F08b

Figure 8. Examples of PCB Metal Used for Heat Dissipation. Driver Package Mounted on Top Layer.

Heat Sink Pad Soldered to Top Layer Metal. Metal Areas Drawn to Scale of Package Size

1739fas, sn1739

11

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