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MC100H605 Ver la hoja de datos (PDF) - ON Semiconductor

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componentes Descripción
Fabricante
MC100H605
ON-Semiconductor
ON Semiconductor 
MC100H605 Datasheet PDF : 7 Pages
1 2 3 4 5 6 7
MC10H605, MC100H605
Registered Hex ECL to TTL
Translator
Description
The MC10/100H605 is a 6bit, registered, dual supply ECL to TTL
translator. The device features differential ECL inputs for both data
and clock. The TTL outputs feature balanced 24 mA sink/source
capabilities for driving transmission lines.
With its differential ECL inputs and TTL outputs the H605 device is
ideally suited for the receive function of a HPPI bus type
boardtoboard interface application. The on chip registers simplify
the task of synchronizing the data between the two boards.
A VBB reference voltage is supplied for use with singleended data
or clock. For singleended applications the VBB output should be
connected to the “bar” inputs (Dn or CLK) and bypassed to ground via
a 0.01 mF capacitor. To minimize the skew of the device differential
clocks should be used.
The ECL level Master Reset pin is asynchronous and common to all
flipflops. A “HIGH” on the Master Reset forces the Q outputs
“LOW”.
The device is available in either ECL standard: the 10H device is
compatible with MECL 10Hlogic levels while the 100H device is
compatible with 100K logic levels.
Features
Differential ECL Data and Clock Inputs
24 mA Sink, 24 mA Source TTL Outputs
Dual Power Supply
Multiple Power and Ground Pins to Minimize Noise
2.0 ns ParttoPart Skew
PbFree Packages are Available*
http://onsemi.com
281
PLCC28
FN SUFFIX
CASE 776
MARKING DIAGRAM*
1 28
MCxxxH605G
AWLYYWW
xxx = 10 or 100
A
= Assembly Location
WL = Wafer Lot
YY
= Year
WW = Work Week
G
= PbFree Package
*For additional marking information, refer to
Application Note AND8002/D.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
*For additional information on our PbFree strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2009
1
September, 2009 Rev. 8
Publication Order Number:
MC10H605/D

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