MC100EP139DTG(2016) Ver la hoja de datos (PDF) - ON Semiconductor
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MC100EP139DTG Datasheet PDF : 14 Pages
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MC10EP139, MC100EP139
Table 3. ATTRIBUTES
Characteristics
Internal Input Pulldown Resistor
Internal Input Pullup Resistor
ESD Protection
Human Body Model
Machine Model
Charged Device Model
Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1)
SOIC−20 WB
TSSOP−20 WB
QFN−20
Flammability Rating
Oxygen Index: 28 to 34
Transistor Count
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
1. For additional information, see Application Note AND8003/D.
Value
75 kW
N/A
> 2 kV
> 100 V
> 2 kV
Pb-Free Pkg
Level 3
Level 1
Level 1
UL 94 V−0 @ 0.125 in
758 Devices
Table 4. MAXIMUM RATINGS
Symbol
Parameter
Condition 1
Condition 2
Rating
Unit
VCC PECL Mode Power Supply
VEE
NECL Mode Power Supply
VI
PECL Mode Input Voltage
NECL Mode Input Voltage
Iout
Output Current
VEE = 0 V
VCC = 0 V
VEE = 0 V
VCC = 0 V
Continuous
Surge
VI ≤ VCC
VI ≥ VEE
6
V
−6
V
6
V
−6
50
mA
100
IBB
VBB Sink/Source
TA
Operating Temperature Range
Tstg
Storage Temperature Range
qJA
Thermal Resistance (Junction-to-Ambient) 0 lfpm
500 lfpm
TSSOP−20 WB
TSSOP−20 WB
±0.5
−40 to +85
−65 to +150
140
100
mA
°C
°C
°C/W
qJC
Thermal Resistance (Junction-to-Case)
Standard Board
qJA
Thermal Resistance (Junction-to-Ambient) 0 lfpm
500 lfpm
TSSOP−20 WB
SOIC−20 WB
SOIC−20 WB
23 to 41
90
60
°C/W
°C/W
qJC
Thermal Resistance (Junction-to-Case)
Standard Board
qJA
Thermal Resistance (Junction-to-Ambient) 0 lfpm
500 lfpm
SOIC−20 WB
QFN−20
QFN−20
33 to 35
47
33
°C/W
°C/W
qJC
Thermal Resistance (Junction-to-Case)
Standard Board
QFN−20
18
°C/W
Tsol
Wave Solder (Pb-Free)
< 2 to 3 sec @ 260°C
265
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
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