Preliminary Electrical Characteristics
Table 18. XOSC (Temperature Range = –40 to 105C Ambient)
#
Characteristic
Symbol Minimum Typical1 Maximum Unit
• Low range (RANGE = 0)
• High range (RANGE = 1),
• FEE or FBE mode 2
flo
32
—
38.4 kHz
fhi-fll
1
—
5
MHz
1
Oscillator crystal or resonator
(EREFS = 1, ERCLKEN = 1)
• High range (RANGE = 1),
• PEE or PBE mode 3
fhi-pll
1
—
16
MHz
• High range (RANGE = 1),
• High gain (HGO = 1),
• FBELP mode
fhi-hgo
1
—
16
MHz
• High range (RANGE = 1),
• Low power (HGO = 0),
• FBELP mode
fhi-lp
1
—
8
MHz
2 Load capacitors
Feedback resistor
3
Low range
(32 kHz to 38.4 kHz)
High range
(1 MHz to 16 MHz)
C1
C2
See Note 4
RF
—
10
—
—
1
—
M
—
Series resistor — Low range
4
Low Gain (HGO = 0)
High Gain (HGO = 1)
—
0
—
RS
k
—
100
—
• Low Gain (HGO = 0)
—
0
—
• High Gain (HGO = 1)
5 Series resistor — High range
8 MHz
RS
—
0
0
k
4 MHz
—
0
10
1 MHz
—
0
20
6 Crystal start-up time 5, 6
Low range, low gain
(RANGE=0,HGO=0)
Low range, high gain
(RANGE=0,HGO=1)
—
200
t
CSTL
—
400
High range, low gain
(RANGE=1,HGO=0)
—
5
tCSTH
High range, high gain (RANGE=1,
HGO=1)
—
15
—
—
ms
—
—
1 Data in Typical column was characterized at 3.0 V, 25C or is typical recommended value.
2 When MCG is configured for FEE or FBE mode, input clock source must be divisible using RDIV to within the range of 31.25 kHz to 39.0625
kHz.
3 When MCG is configured for PEE or PBE mode, input clock source must be divisible using RDIV to within the range of 1 MHz to 2 MHz.
4 See crystal or resonator manufacturer’s recommendation.
5 This parameter is characterized and not tested on each device.
6 Proper PC board layout procedures must be followed to achieve specifications.
o
MCF51JE256 Datasheet, Rev. 4
Freescale Semiconductor
31