MPXV5004GC6T1 Ver la hoja de datos (PDF) - Freescale Semiconductor

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MPXV5004GC6T1

Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated

Freescale Semiconductor 

PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE

Freescale Semiconductor designates the two sides of the

Freescale Semiconductor pressure sensor is designed to

pressure sensor as the Pressure (P1) side and the Vacuum

operate with positive differential pressure applied, P1 > P2.

(P2) side. The Pressure (P1) side is the side containing

The Pressure (P1) side may be identified by using the

silicone gel which isolates the die from the environment. The

table below.

Part Number

MPXV5004GC6U/T1

MPXV5004G6U/T1

MPXV5004GC7U

MPXV5004G7U

MPXV5004GP

MPXV5004DP

MPXV5004GVP

Case Type

482A

482

482C

482B

1369

1351

1368

Pressure (P1) Side Identifier

Side with Port Attached

Stainless Steel Cap

Side with Port Attached

Stainless Steel Cap

Side with Port Attached

Side with Port Marking

Stainless Steel Cap

INFORMATION FOR USING THE SMALL OUTLINE PACKAGE (CASE 482)

MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE

MOUNTED APPLICATIONS

Surface mount board layout is a critical portion of the total

design. The footprint for the surface mount packages must be

the correct size to ensure proper solder connection interface

between the board and the package. With the correct

footprint, the packages will self align when subjected to a

solder reflow process. It is always recommended to design

boards with a solder mask layer to avoid bridging and

shorting between solder pads.

0.660

16.76

0.100 TYP 8X

2.54

0.060 TYP 8X

1.52

0.300

7.62

0.100 TYP 8X

2.54

inch

mm SCALE 2:1

Figure 5. SOP Footprint (Case 482)

MPXV5004G

4

Sensors

Freescale Semiconductor

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