NCP1250
ELECTRICAL CHARACTERISTICS
(For typical values TJ = 25C, for min/max values TJ = −40C to +125C, Max TJ = 150C, VCC = 12 V unless otherwise noted)
Symbol
Rating
Pin Min Typ Max Unit
SUPPLY SECTION − (For the best efficiency performance, we recommend a VCC below 20 V)
VCCON VCC increasing level at which driving pulses are authorized
VCC(min) VCC decreasing level at which driving pulses are stopped
VCCHYST Hysteresis VCCON − VCC(min)
VZENER Clamped VCC when latched off / burst mode activation @ ICC = 500 mA
ICC1 Start−up current
5
16
18
20
V
5 8.2 8.8 9.4
V
5 6.0
V
5
7.0
V
5
15 mA
ICC2 Internal IC consumption with IFB = 50 mA, FSW = 65 kHz and CL = 0 nF
5
ICC3 Internal IC consumption with IFB = 50 mA, FSW = 65 kHz and CL = 1 nF
5
ICC2 Internal IC consumption with IFB = 50 mA, FSW = 100 kHz and CL = 0 nF
5
ICC3 Internal IC consumption with IFB = 50 mA, FSW = 100 kHz and CL = 1 nF
5
ICCLATCH Current flowing into VCC pin that keeps the controller latched (Note 4)
5
TJ = −40C to +125C
TJ = 0C to +125C
ICCstby Internal IC consumption while in skip cycle (VCC = 12 V, driving a typical 6 A/600 V 5
MOSFET)
1.4 2.2 mA
2.1 3.0 mA
1.7 2.5 mA
3.1 4.0 mA
mA
40
32
550
mA
Rlim
Current−limit resistor in series with the latch SCR
DRIVE OUTPUT
5
4.0
kW
Tr
Output voltage rise−time @ CL = 1 nF, 10−90% of output signal
Tf
Output voltage fall−time @ CL = 1 nF, 10−90% of output signal
ROH
Source resistance
ROL
Sink resistance
Isource Peak source current, VGS = 0 V – (Note 5)
Isink
Peak sink current, VGS = 12 V – (Note 5)
VDRVlow DRV pin level at VCC close to VCC(min) with a 33 kW resistor to GND
VDRVhigh DRV pin level at VCC = 28 V – DRV unloaded
CURRENT COMPARATOR
6
40
ns
6
30
ns
6
13
W
6
6.0
W
6
300
mA
6
500
mA
6 8.0
V
6
10
12
14
V
IIB
VLimit1
VLimit2
Vfold
Vfreeze
TDEL
TLEB
TSS
Input Bias Current @ 0.8 V input level on pin 4
Maximum internal current setpoint – TJ = 25C – pin 3 grounded
Maximum internal current setpoint – TJ = −40C to 125C – pin 3 grounded
Default internal voltage set point for frequency foldback trip point – 45% of Vlimit
Internal peak current setpoint freeze ([31% of Vlimit)
Propagation delay from current detection to gate off−state
Leading Edge Blanking Duration
Internal soft−start duration activated upon startup, auto−recovery
4
0.02
mA
4 0.744 0.8 0.856 V
4 0.72 0.8 0.88 V
3
357
mV
3
250
mV
4
100 150 ns
4
300
ns
−
4.0
ms
IOPPo Setpoint decrease for pin 3 biased to –250 mV – (Note 6)
3
31.3
%
IOOPv
IOOPv
IOPPs
Voltage setpoint for pin 3 biased to −250 mV – (Note 6), TJ = 25C
Voltage setpoint for pin 3 biased to −250 mV – (Note 6), TJ = −40C to 125C
Setpoint decrease for pin 3 grounded
3 0.51 0.55 0.60 V
3 0.50 0.55 0.62 V
3
0
%
INTERNAL OSCILLATOR
fOSC
fOSC
Dmax
Oscillation frequency (65 kHz version)
Oscillation frequency (100 kHz version)
Maximum duty−cycle
−
61
65
71 kHz
−
92 100 108 kHz
−
76
80
84
%
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5