PA162 Ver la hoja de datos (PDF) - Cirrus Logic
Número de pieza
componentes Descripción
Fabricante
PA162 Datasheet PDF : 6 Pages
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Product Innova tionFrom
PA162
Parameter
POWER SUPPLY
VOLTAGE, Vss4
CURRENT, quiescent +Vs (A/B)
CURRENT, quiescent +Vs (C/D)
CURRENT, quiescent total
THERMAL
RESISTANCE, junction to case
DC, 1 amplifier
DC, 2 amplifiers5
DC, 3 amplifiers5
DC, 4 amplifiers5
AC, 1 amplifier
AC, 2 amplifiers5
AC, 3 amplifiers5
AC, 4 amplifiers5
RESISTANCE, junction to air7
Test Conditions2,3
Min
Typ
Max
Units
5
30
40
V
8
10
mA
8
10
mA
16
20
mA
7.16
7.87
°C/W
4.69
5.16
°C/W
3.08
3.39
°C/W
2.51
2.77
°C/W
5.37
5.90
°C/W
3.52
3.87
°C/W
2.31
2.54
°C/W
1.89
2.07
°C/W
25
°C/W
NOTES:
1. (All Min/Max characteristics and specifications are guaranteed over the Specified Operating Condi-
tions. Typical performance characteristics and specifications are derived from measurements taken
at typical supply voltages and TC = 25°C).
2. Long term operation at the maximum junction temperature will result in reduced product life. Derate
power dissipation to achieve high MTTF.
3. Unless otherwise noted, the following conditions apply: ±VS = ±15V, T C =25°C.
4. +VS and -Vs denote the positive and negative rail respectively. VSS denotes total rail-to-rail supply.
5. Rating applies when power dissipation is equal in each of the amplifiers. Power and thermal ratings
are based on two separate dual monolithic power op-amps on one integrated copper heatslug.
Amplifiers A and B are combined on one monolithic die while amplifiers C and D are on the other.
6.
If
-Vs
is
disconnected
before
+Vs,
a
diode
between
-V
s
and
ground
is
recommended
to
avoid
dam-
age.
7. Rating applies when the heatslug of the DK package is soldered to a minimum of 1 square inch foil
area of a printed circuit board.
NC
1
-IN(A)
A
+IN(A)
+IN(B)
B
-IN(B)
-IN(C)
C
+IN(C)
+IN(D)
D
-IN(D)
NC
10
20
-VS
OUT(A)
+VS(A/B)
OUT(B)
-VS
-VS
OUT(C)
+VS(C/D)
OUT(D)
11
-VS
20-pin PSOP
PACKAGE STYLE DK
FIGURE 2. External Connections.
PA162U
3
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