RT9013-33GB Ver la hoja de datos (PDF) - Richtek Technology

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RT9013-33GB

500mA, Low Dropout, Low Noise Ultra-Fast Without Bypass Capacitor CMOS LDO Regulator

Richtek Technology 

Preliminary

Where TJ(MAX) is the maximum operation junction

temperature, TA is the ambient temperature and the θJA is

the junction to ambient thermal resistance.

For recommended operating conditions specification of

RT9013, where TJ(MAX) is the maximum junction

temperature of the die (125°C) and TA is the operated

ambient temperature. The junction to ambient thermal

resistance θJA (θJA is layout dependent) for WDFN-6L 2x2

package is 165°C/W, SOT-23-5 package is 250°C/W and

SC-70-5 package is 333°C/W on the standard

JEDEC 51-3 single-layer thermal test board. The maximum

power dissipation at TA = 25°C can be calculated by

following formula :

PD(MAX) = (125°C − 25°C) / 165 = 0.606 W for

WDFN-6L 2x2 packages

PD(MAX) = (125°C − 25°C) / 250 = 0.400 W for SOT-23-5

packages

PD(MAX) = (125°C − 25°C) / 333 = 0.300 W for SC-70-5

packages

The maximum power dissipation depends on operating

ambient temperature for fixed TJ(MAX) and thermal resistance

θJA. For RT9013 packages, the Figure 2 of derating curves

allows the designer to see the effect of rising ambient

temperature on the maximum power allowed.

0.7

Single Layer PCB

0.6

0.5

SOT-23-5

0.4

WDFN-6L 2x2

0.3

SC-70-5

0.2

0.1

0

0 12.5 25 37.5 50 62.5 75 87.5 100 113 125

Ambient Temperature (°C)

Figure 2. Derating Curves for RT9013 Packages

DS9013-05 August 2007

RT9013

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