TLRME17DPF Ver la hoja de datos (PDF) - Toshiba

Número de pieza

componentes Descripción

Fabricante

TLRME17DPF

TOSHIBA LED Lamp

Toshiba 

TOSHIBA LED Lamp

TLRME17DP(F)

Panel Circuit Indicator

• Lead(Pb)-free products (lead: Sn-Ag-Cu)

• 5mm package

• InGaAℓP technology

• All plastic mold type

• Diffused color lens

• High intensity light emission

• Excellent low current light output

• Applications:

outdoor message signboards, safety equipment, automotive use, etc

TLRME17DP(F)

Unit: mm

Lineup

Product Name

TLRME17DP(F)

Color

Red

Material

InGaAlP

JEDEC

JEITA

TOSHIBA

―

―

4-5AJ2

Absolute Maximum Ratings (Ta = 25°C)

Weight: 0.31 g (Typ.)

Product Name

TLRME17DP(F)

Forward Current

IF (mA)

50

Reverse Voltage

VR (V)

4

Power Dissipation

PD (mW)

120

Operating

Temperature

Topr (°C)

−40~100

Storage

Temperature

Tstg (°C)

−40~120

Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the

significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even

if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum

ratings.

Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook

(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test

report and estimated failure rate, etc).

Electrical and Optical Characteristics (Ta = 25°C)

Product Name

TLRME17DP(F)

Unit

Typ. Emission Wavelength

λd

λP

Δλ

IF

626 (636) 23

20

nm

mA

Luminous Intensity

IV

Min Typ.

IF

153 500

20

mcd

mA

Forward Voltage

VF

Typ. Max

IF

1.9

2.4

20

V

mA

Reverse Current

IR

Max

VR

50

4

μA

V

Precautions

Please be careful of the following:

• Soldering temperature: 260°C max, soldering time: 3 s max

(soldering portion of lead: up to 1.6 mm from the body of the device)

• If the lead is formed, the lead should be formed up to 1.6 mm from the body of the device without forming stress

to the resin. Soldering should be performed after lead forming.

• This visible LED lamp also emits some IR light.

If a photodetector is located near the LED lamp, please ensure that it will not be affected by this IR light.

1

2007-10-01

Share Link: