W523S99 Ver la hoja de datos (PDF) - Winbond
Número de pieza
componentes Descripción
Fabricante
W523S99 Datasheet PDF : 14 Pages
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W523SXX (PRELIMINARY)
Output Current of
IOL1 VDD = 3V, Vout = 0.4V
0.8
mA
STPA-STPE
IOH1 VDD = 3V, Vout = 2.7V
-0.8
mA
Output Current of
IOL2 VDD = 3V, Rl = 8Ω
100
mA
SPK+, SPK-
IOH2
-100
mA
AC CHARACTERISTICS
PARAMETER
Oscillation Frequency
(W58300 ICE chip)
Oscillation Frequency
(W523Sxx production
chip)
Oscillation Frequency
Deviation by Voltage
Drop
Instruction Cycle Time
POI Delay Time
Long Debounce Time
Short Debounce Time
SYM.
Fosc1
Fosc2
CONDITIONS
Ring oscillator, Rosc = 270 KΩ
Ring oscillator, Rosc = 560 KΩ
Ring Oscillator, Rosc = 1.2 MΩ
Ring Oscillator, Rosc = 2.4 MΩ
MIN.
2.7
1.3
2.7
1.3
TYP.
3
1.5
3
1.5
MAX.
3.3
1.7
3.3
1.7
UNIT
MHz
MHz
MHz
MHz
∆Fosc2
Fosc2
F(3V)-F(2.4V)
F(3V)
Tins
TPD
TDEBL
TDEBS
Fosc = 3 MHz, SR = 6 KHz
Fosc = 3 MHz
Fosc = 3 MHz, SR = 6 KHz
7.5
%
1/3
mS
160
mS
50
mS
400
µS
BONDING PAD DIAGRAM
19
1
2
3
4 5 6 7 8 9 10 11 12 13 14 15 16 17
18
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Publication Release Date: Oct 2000
Revision A5
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