DatasheetQ Logo
Electronic component search and free download site. Transistors,MosFET ,Diode,Integrated circuits

WM8971L Ver la hoja de datos (PDF) - Wolfson Microelectronics plc

Número de pieza
componentes Descripción
Fabricante
WM8971L
Wolfson
Wolfson Microelectronics plc 
WM8971L Datasheet PDF : 56 Pages
First Prev 51 52 53 54 55 56
Advanced Information
PACKAGE DIMENSIONS
FL: 32 PIN QFN PLASTIC PACKAGE 5 X 5 X 0.9 mm BODY, 0.50 mm LEAD PITCH
CORNER
TIE BAR
B
5
25
24
D2
D2/2
SEE DETAIL A
32
L
1
E2/2
D
INDEX AREA
(D/2 X E/2)
A
E2
SEE DETAIL B
WM8971L
DM030.C
E
17
16 15
e
(A3)
1
C
SEATING PLANE
8
9
b
B
A
A1
DETAIL B
2X
2X
aaa C
aaa C
TOP VIEW
ccc C
0.08 C
DETAIL A
1
32x b
bbb M C A B
EXPOSED
CENTRE
PAD
0.43 mm
0.566 mm
R
CORNER
TIE BAR
5
1
L1
Symbols
Dimensions (mm)
MIN
NOM
MAX
NOTE
A
0.85
0.90
1.00
A1
0
0.02
0.05
A3
0.2 REF
b
0.18
0.23
0.30
1
D
4.90
5.00
5.10
D2
3.2
3.3
3.4
2
E
4.90
5.00
5.10
E2
3.2
3.3
3.4
2
e
0.5 BSC
L
0.35
0.4
0.45
L1
0.1
1
R
b(min)/2
K
0.20
Tolerances of Form and Position
aaa
0.15
bbb
0.10
ccc
0.10
REF:
JEDEC, MO-220, VARIATION VKKD-2
NOTES:
1. DIMENSION b APPLIED TO METALLIZED TERMINAL AND IS MEASURED BETWEEN 0.25 mm AND 0.30 mm FROM TERMINAL TIP. DIMENSION L1 REPRESENTS TERMINAL PULL BACK FROM
PACKAGE SIDE WALL. MAXIMUM OF 0.1mm IS ACCEPTABLE. WHERE TERMINAL PULL BACK EXISTS, ONLY UPPER HALF OF LEAD IS VISIBLE ON PACKAGE SIDE WALL DUE TO HALF
ETCHING OF LEADFRAME.
2. FALLS WITHIN JEDEC, MO-220 WITH THE EXCEPTION OF D2, E2:
D2,E2: LARGER PAD SIZE CHOSEN WHICH IS JUST OUTSIDE JEDEC SPECIFICATION
3. ALL DIMENSIONS ARE IN MILLIMETRES
4. THIS DRAWING IS SUBJECT TO CHANGE WITHOUT NOTICE.
5. SHAPE AND SIZE OF CORNER TIE BAR MAY VARY WITH PACKAGE TERMINAL COUNT. CORNER TIE BAR IS CONNECTED TO EXPOSED PAD INTERNALLY
w
AI Rev 3.0 March 2004
55

Share Link: 

datasheetq.com  [ Privacy Policy ]Request Datasheet ] [ Contact Us ]