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BAP65-02,115(2010) Ver la hoja de datos (PDF) - NXP Semiconductors.

Número de pieza
componentes Descripción
Fabricante
BAP65-02,115
(Rev.:2010)
NXP
NXP Semiconductors. 
BAP65-02,115 Datasheet PDF : 9 Pages
1 2 3 4 5 6 7 8 9
NXP Semiconductors
12. Contents
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1
General description . . . . . . . . . . . . . . . . . . . . . 1
1.2
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
1.3
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 1
3
Ordering information . . . . . . . . . . . . . . . . . . . . . 1
4
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
5
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
6
Thermal characteristics . . . . . . . . . . . . . . . . . . 2
7
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 2
8
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5
9
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 6
10
Legal information. . . . . . . . . . . . . . . . . . . . . . . . 7
10.1
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 7
10.2
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
10.3
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
10.4
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
11
Contact information. . . . . . . . . . . . . . . . . . . . . . 8
12
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
BAP65-02
Silicon PIN diode
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2010.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 28 September 2010
Document identifier: BAP65-02

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