HI-8571 Ver la hoja de datos (PDF) - Holt Integrated Circuits
Número de pieza
componentes Descripción
Fabricante
HI-8571 Datasheet PDF : 9 Pages
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HI-8570 / HI-8571 PACKAGE DIMENSIONS
8-PIN PLASTIC SMALL OUTLINE (ESOIC) - NB
(Narrow Body, Thermally Enhanced)
inches (millimeters)
Package Type: 8HNE
Top View
(.41.9930)BSC
.007 ± .003
(.175 ± .075)
Bottom View
.154 ± .04
(3.90 ± 1.10)
(.62.3060)BSC
PIN 1
(.31.5940)BSC
.119 ± .04
(3.02 ± .97)
BSC = “Basic Spacing between Centers”
is theoretical true position dimension and
has no tolerance. (JEDEC Standard 95)
.016 ± .004
(.410 ± .100)
.050 BSC
(1.27)
SEE DETAIL A
.056 ± .006
(1.413 ± .163)
0° to 8°
Electrically isolated heat
sink pad on bottom of
package
Connect to any ground or
power plane for optimum
thermal dissipation
.033 ± .017
(.835 ± .435)
.100 ± .10
(.04 ± .04)
DETAIL A
8-PIN PLASTIC DIP
.385 ±.015
(9.799 ±.381)
.250 ± .010
(6.350 ±.254)
.100 BSC
(2.54)
.135 ±.015
(3.429 ±.381)
.1375 ±.0125
(3.493 ±.318)
BSC = “Basic Spacing between Centers”
is theoretical true position dimension and
has no tolerance. (JEDEC Standard 95)
.019 ±.002
(.483 ±.102)
.025 ±.010
(.635 ± .254)
.055 ±.010
(1.397 ±.254)
inches (millimeters)
Package Type: 8P
.300 ±.010
(7.620 ±.254)
.0115 ±.0035
(.292 ±.089)
.335 ±.035
(8.509 ±.889)
HOLT INTEGRATED CIRCUITS
8
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