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MBRB3030CT Ver la hoja de datos (PDF) - ON Semiconductor

Número de pieza
componentes Descripción
Fabricante
MBRB3030CT
ON-Semiconductor
ON Semiconductor 
MBRB3030CT Datasheet PDF : 6 Pages
1 2 3 4 5 6
MBRB3030CT
THERMAL CHARACTERISTICS (Per Leg)
Characteristic
Thermal Resistance, − Junction−to−Case
− Junction−to−Ambient (Note 2)
2. When mounted using minimum recommended pad size on FR−4 board.
ELECTRICAL CHARACTERISTICS (Per Leg)
Characteristic
Maximum Instantaneous Forward Voltage (Note 3), Per Leg
(IF = 15 Amps, TC = +25°C)
(IF = 15 Amps, TC = +150°C)
(IF = 30 Amps, TC = +25°C)
(IF = 30 Amps, TC = +150°C)
Maximum Instantaneous Reverse Current (Note 3), Per Leg
(Rated dc Voltage, TC = +25°C)
(Reverse Voltage = 10 V, TC = +150°C)
(Rated dc Voltage, TC = +150°C)
3. Pulse Test: Pulse Width = 300 ms, Duty Cycle 2.0%.
Symbol
RqJC
RqJA
Symbol
VF
IR
Value
1.0
50
Unit
°C/W
Value
Unit
V
0.54
0.47
0.67
0.66
mA
0.6
46
145
ORDERING INFORMATION
MBRB3030CT
Device
Package
D2PAK
Shipping
50 Units / Rail
MBRB3030CTG
D2PAK
(Pb−Free)
50 Units / Rail
MBRB3030CTT4
D2PAK
800 Units / Tape & Reel
MBRB3030CTT4G
D2PAK
(Pb−Free)
800 Units / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
http://onsemi.com
2

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