NCV8508D2T50R4G(2009) Ver la hoja de datos (PDF) - ON Semiconductor

Número de pieza

componentes Descripción

Fabricante

NCV8508D2T50R4G
(Rev.:2009)

5.0 V, 250 mA LDO with Watchdog and RESET

ON Semiconductor 

NCV8508

THERMAL DATA

Recommend Thermal Data for SOIC−16 Package

Parameter

Test Conditions Typical Value

min−pad board (Note 6)

1”−pad board (Note 7)

Junction−to−Lead (psi−JL, YJL)

20

15

Junction−to−Ambient (RqJA, qJA)

100

83

6. 1 oz. copper, 94 mm2 copper area, 0.062” thick FR4.

7. 1 oz. copper, 767 mm2 copper area, 0.062” thick FR4.

Units

°C/W

°C/W

Figure 19. Min Pad PCB Layout

Figure 21. Internal Construction of the Package

(notice pins 4, 5 and 12, 13 are connected to flag)

Figure 20. Min Pad PCB Layout

http://onsemi.com

10

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