µPG110P
QUALITY ASSURANCE (Refer to GET-30116)
1. 100 % Tests
1-1 100 % DC Probe
1-2 Visual Inspection
MIL-STD-883 Method 2010
Condition B
2. Tests on Sampling Basis
2-1 Bond Pull Tests (In case of recommended chip handling)
MIL-STD-883 Method 2011
5 samples/wafer and 20 points tested
Accept 0/Reject 1
2-2 Tests in Standard Package
Test the electrical characteristics of chips assembled into the standard package used for µPG110B
5 samples/wafer tested
DC and RF measurement Accept 1/Reject 2
3. Warrantee
NEC has a responsibility of quality assurance for the products within 180 days after delivered to customers where these
are handled properly and stored in a desiccater with the flow of dry N2 gas.
4. Caution
4-1 Take great care to prevent static electricity.
4-2 Be sure that Die Attach is performed in N2 atmosphere.
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