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LTC1061AC(RevC) Ver la hoja de datos (PDF) - Linear Technology

Número de pieza
componentes Descripción
Fabricante
LTC1061AC
(Rev.:RevC)
Linear
Linear Technology 
LTC1061AC Datasheet PDF : 16 Pages
First Prev 11 12 13 14 15 16
U
PACKAGE DESCRIPTIO Dimensions in inches (millimeters) unless otherwise noted.
LTC1061
0.290 – 0.320
(7.366 – 8.128)
0.008 – 0.018
(0.203 – 0.457)
0.385 ± 0.025
(9.779 ± 0.635)
0.160
(4.064)
MAX
0.015 – 0.060
(0.381 – 1.524)
0° – 15°
0.125
(3.175)
MIN
0.080
(2.032)
TYP
J Package
20-Lead Ceramic DIP
0.200
(5.080)
MAX
1.060
(26.924)
MAX
20 19 18 17 16 15 14 13 12 11
0.038 – 0.068
(0.965 – 1.727)
0.014 – 0.026
(0.356 – 0.660)
0.220 – 0.310 0.025
(5.588 – 7.874) (0.635)
RAD TYP
0.100 ± 0.010
(2.540 ± 0.254)
1 2 3 4 5 6 7 8 9 10
0.005
(0.127)
MIN
0.300 – 0.325
(7.620 – 8.255)
0.009 – 0.015
(0.229 – 0.381)
+0.025
0.325 –0.015
( ) 8.255
+0.635
–0.381
0.130 ± 0.005
(3.302 ± 0.127)
0.015
(0.381)
MIN
0.125
(3.175)
MIN
N Package
20-Lead Plastic DIP
0.045 – 0.065
(1.143 – 1.651)
1.040
(26.416)
MAX
20 19 18 17 16 15 14 13 12 11
0.065 ± 0.015
(1.651 ± 0.381)
0.100 ± 0.010
(2.540 ± 0.254)
0.065
(1.651)
TYP
0.260 ± 0.010
(6.604 ± 0.254)
0.018 ± 0.003
(0.457 ± 0.076)
1 2 3 4 5 6 7 8 9 10
S Package
20-Lead Plastic SOL
0.005
(0.127)
RAD MIN
0.291 – 0.299
(7.391 – 7.595)
0.010
(0.254
0.029
0.737)
×
45°
0.093 – 0.104
(2.362 – 2.642)
0.037 – 0.045
(0.940 – 1.143)
0° – 8° TYP
0.050
0.009 – 0.013
(1.270)
(0.229 – 0.330)
SEE NOTE
TYP
0.016 – 0.050
0.014 – 0.019
(0.406 – 1.270)
(0.356 – 0.482)
TYP
NOTE:
PIN 1 IDENT, NOTCH ON TOP AND CAVITIES ON THE BOTTOM OF PACKAGES ARE THE MANUFACTURING OPTIONS.
THE PART MAY BE SUPPLIED WITH OR WITHOUT ANY OF THE OPTIONS.
0.004 – 0.012
(0.102 – 0.305)
SEE NOTE
0.496 – 0.512
(12.598 – 13.005)
20 19 18 17 16 15 14 13 12 11
0.394 – 0.419
(10.007 – 10.643)
1 2 3 4 5 6 7 8 9 10
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
15

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