APL840N Ver la hoja de datos (PDF) - APLUS INTEGRATED CIRCUITS
Número de pieza
componentes Descripción
Fabricante
APL840N Datasheet PDF : 10 Pages
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APLUS
BONDING DIAGRAM
6
5
7
4
8
3
9
2
10
1
11
20
12
19
13
18
14
17
Y 15
16
X
(0,0)
Note: Substrate must be connected to GND
Pad size = 100 mm x 100 mm
Die size:3628mm x 3797mm
DC CHARACTERISTICS
Symbol
VCC
ISB
IOP
VIH
VIL
IOH
IOL
ICO
ISTPH
TSTPL
ILED
DF/F
Parameter Description
Operating Voltage
Standby Current
Operating Current
Input HIGH Voltage
Input LOW Voltage
VOUT LOW O/P Current
VOUT HIGH O/P Current
COUT O/P Current
STP LOW O/P Current
STP HIGH O/P Current
Output Current LED
Frequency Stability
API840N
BONDING PARAMETERS
Pin
Name
X
1
TG8
3451.9
2
LED1
3451.9
3
VOUT1
3451.9
4
VOUT2
3451.9
5
GND
3368.10
6
STP
137.18
7
LED2
100.4
8
COUT
100.4
9
OSC
100.4
10
TG5
100.4
11
TG6
100.4
12
VPP
100.4
13
TG1
100.4
14
TG2
100.4
15
VCC
187.05
16
TG3
3372.5
17
TG4
3451.9
18
SBT
3451.9
19
IRP
3451.9
20
TG7
3451.94
Y
1599.7
1861.0
2147.6
2444.5
2803.35
2795.93
2486.3
2245.0
1790.0
1469.5
1230.0
989.6
662.3
422.7
113.78
141.8
581.5
836.0
1090.6
1345.13
Condition
VCC = 3.0V, I/O Open
Vcc = 3.0V, I/O Open
Vcc = 3.0V
Vcc = 3.0V
Vcc = 3.0V, VOUT = 0V
Vcc = 3.0V, VOUT = 3.0V
Vcc = 3.0V, VCOUT = 0.7V
Vcc = 3.0V, VSTP = 0V
Vcc = 3.0V, VSTP = 3.0V
Vcc = 3.0V - 6.0V
FOSC(3V) - F OSC(3.5V)
FOSC (3V)
Min.
3.0
-
-
2.5
-0.3
-
-
-
-
-
6
-
Typ.
4.5
1
-
3.0
0
-12
12
-2
-5
5
8
-
Max. Unit
5.0
V
5
mA
100 mA
3.5
V
0.3
V
-
mA
-
mA
-
mA
-
mA
-
mA
10 mA
5
%
5
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