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BMI-C-002

INTRODUCTION TO BOARD LEVEL SHIELDS AND CONTACTS

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CUSTOM DESIGN SHIELDS AND CONTACTS

EZ PEELTM SHIELD DESIGN

Economical Access for Low Incidences of Repairs

In cases where there is a low incidence of repairable circuit defects, access

may be needed to shielded components. An economical solution is EZ Peel

shields. These one-piece shields feature an easy-to-remove top section that

can be peeled back using simple tools for access to components. Built-in

flexibility controls the ease of removing the top, and the robust design

delivers superior flatness. EZ Peel shields are designed to accept a snap-on

cover in the same manner as our two-piece shields, following circuit repair.

• Available in cold rolled steel, brass, stainless steel and nickel silver

• Molded Compartment Shields and Form-In-Place elastomers can be

combined with drawn board level shields to achieve shielding of

multiple components with a single part

• Available with an EZ Peel scored cover feature; allows for easy top

section removal for component repair and re-sealing

• Ventilation holes as needed for solder outgassing.

Series 97-2100

MULTI-COMPARTMENTAL SHIELD DESIGN

Shield Multiple Circuit Groups Save PCB Space and Production Time

Printed circuit boards with multiple circuit groups pose unique design

challenges. Shielding these groups separately adversely affects circuit board

real estate and increases part count. Multi-compartmental shields allow

replacement of three or more single shields with one shield divided into

several walled compartments. Installing a single part reduces part count,

along with production time through faster pick-and-place speeds. This allows

for a reduction the number of parts in inventory, which lowers overhead

costs.

Multi-compartmental shields feature internal dividing walls of one material

thickness and meet all on-board shield requirements for FCC, VDE, CISPR

and CE. These shields are available in two-piece designs, either assembled

or unassembled. Our unassembled versions allow for automatic optical

inspection prior to cover placement. As in all our shielding offerings, Laird

Technologies proprietary process for 100% automatic optical inspection

verifies co-planarity including inner walls.

DRAWN BOARD LEVEL SHIELDS

Seamless Corners Address High-Frequency Leakage

As microprocessor speeds continue to increase, so does the potential for

EMI leakage through the smallest apertures in board level shields. Laird

Technologies drawn board level shields are designed to provide additional

near-field and far-field circuit isolation (attenuation) at higher frequencies

by eliminating the apertures found in the corners of traditional board level

solutions. Drawn board level shields utilize small ground trace sizes, thereby

preserving space on the circuit board.

• Solid corner designs when additional circuit isolation (attenuation) is

required at higher frequencies

• Available in custom heights up to .250" (6,4 mm) with length and width

dimensions from .300" (7,6 mm) to 2.0" (50,8 mm)

• Tape and reel packaging provides an economical and automated SMT

attachment method

^ The receive antenna test region from 1 GHz to 10 GHz that defines the Far-Field and

Near-Field is 2.0" and 0.190", respectfully, from the transmit antenna. This test is performed

for worst case orientation.

Circuit Isolation is a measurement that defines the resultant attenuation level in dB provided

by a PCB shield from an initial reference level as defined in Laird test procedure PDA-PRO-

027.

Notice: The data set forth in all text, tables, charts, graphs and figures herein are based on samples tested and are

not guaranteed for all samples or applications. Such data are intended as guides and do not reflect product

specification for any specific part.

www.lairdtech.com 21

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