RT7257G Ver la hoja de datos (PDF) - Richtek Technology
Número de pieza
componentes Descripción
Fabricante
RT7257G Datasheet PDF : 15 Pages
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RT7257G
Layout Consideration
Follow the PCB layout guidelines for optimal performance
of the RT7257G.
` Keep the traces of the main current paths as short and
wide as possible.
` Put the input capacitor as close as possible to the device
pins (VIN and GND).
` SW node is with high frequency voltage swing and
should be kept at small area. Keep analog components
away from the SW node to prevent stray capacitive noise
pick-up.
` Connect feedback network behind the output capacitors.
Keep the loop area small. Place the feedback
components near the RT7257G.
` An example of PCB layout guide is shown in Figure 9
for reference.
GND
VIN
Input capacitor must
be placed as close
to the IC as possible.
VOUT
CIN
L
SW GND
CBOOT
BOOT
VIN
SW
GND
8
2
7
GND
3
6
9
4
5
VIN The feedback components
must be connected as close
CSS
REN to the device as possible.
CC
SS
EN
CP RC
COMP
R1
FB
R2
COUT
SW node is with high frequency voltage swing and should
be kept at small area. Keep analog components away from
the SW node to prevent stray capacitive noise pick-up
VOUT
GND
Figure 9. PCB Layout Guide
Location
CI N
CI N
CI N
COUT
COUT
COUT
COUT
Table 3. Suggested Capacitors for CIN and COUT
Component Supplier
Part No.
Capacitance (μF)
MURATA
GRM31CR61E106K
10
TDK
C3225X5R1E106K
10
TAIYO YUDEN
TMK316BJ106ML
10
MURATA
GRM31CR60J476M
47
TDK
C3225X5R0J476M
47
MURATA
GRM32ER71C226M
22
TDK
C3225X5R1C22M
22
Case Size
1206
1206
1206
1206
1210
1210
1210
Copyright ©2012 Richtek Technology Corporation. All rights reserved.
www.richtek.com
14
is a registered trademark of Richtek Technology Corporation.
DS7257G-01 September 2012
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