GQM1885C2AR75CB01D Ver la hoja de datos (PDF) - Murata Manufacturing

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GQM1885C2AR75CB01D

Chip Monolithic Ceramic Capacitors

Murata Manufacturing 

C02E.pdf !Note • Th!is PNDoFteca•taPlolegasisedroewadnlroaatdinegdafnrodm!thCeAwUeTbIOsiNte(ofof rMsutoraratageM, aonpuefraactitnugri,nrgatcinog.,,ltsdo.ldTehreinregf,omreo,uint’tsinsgpaencdifichaatniodnlisnga)reinstuhbisjeccatttaolocghatongpereovreonut rsmprookdiuncgtsanind/iot rmbauyrnbiengd,isectco.ntinued without advance notice. Please check with our

sales repres•enTthaistivceastaolor gprhoadsucotnelyntgyipniecearlsspbeecfoifriceaotirodnesribnegc. ause there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

09.9.18 • This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Continued from the preceding page.

Land Layout to Prevent Excessive Solder

Mounting Close to a Chassis

d1

Chassis

Solder (Ground solder)

Examples of

Prohibition

Adhesive

Base board

Land Pattern

in section

Examples of

Improvements

by the Land

Division

d2

d1<d2

Solder Resist

in section

Notice

Mounting with Leaded Components

Lead Wire Connected

to a Part Provided

with Lead Wires.

Mounting Leaded Components Later

Soldering Iron

Lead Wire of

Component to be

Connected Later.

in section

Solder Resist

Solder Resist

in section

in section

in section

2. Mounting of Chips

Thickness of adhesives applied

Keep thickness of adhesives applied (50-105µm or more)

to reinforce the adhesive contact considering the

thickness of the termination or capacitor (20-70µm) and

the land pattern (30-35µm).

Mechanical shock of the chip placer

When the positioning claws and pick-up nozzle are worn,

the load is applied to the chip while positioning is

concentrated in one position, thus causing cracks,

breakage, faulty positioning accuracy, etc.

Careful checking and maintenance are necessary to

prevent unexpected trouble.

An excessively low bottom dead point of the suction

nozzle imposes great force on the chip during mounting,

causing cracked chips. Please set the suction nozzle's

bottom dead point on the upper surface of the board.

3. Soldering

(1) Limit of losing effective area of the terminations and

conditions needed for soldering.

Depending on the conditions of the soldering

temperature and/or immersion (melting time),

effective areas may be lost in some part of the

terminations.

To prevent this, be careful in soldering so that any

possible loss of the effective area on the terminations

will securely remain at a maximum of 25% on all

edge length A-B-C-D-A of part with A, B, C, D, shown

in the Figure below.

A

B

C

D

Termination

(2) Flux Application

An excessive amount of flux generates a large quantity of

flux gas, causing deteriorated solderability. So apply flux

thinly and evenly throughout. (A foaming system is

generally used for flow soldering.)

Flux containing too high percentage of halide may cause

corrosion of the outer electrodes unless sufficient

cleaning. Use flux with a halide content of 0.2% max.

Do not use strong acidic flux.

Do not use water-soluble flux*.

(*Water-soluble flux can be defined as non rosin type flux

18

including wash-type flux and non-wash-type flux.)

Continued on the following page.

215

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