CXA2074Q Ver la hoja de datos (PDF) - Sony Semiconductor
Número de pieza
componentes Descripción
Fabricante
CXA2074Q Datasheet PDF : 38 Pages
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Package Outline
Unit: mm
CXA2074Q
15.3 ± 0.4
+ 0.4
12.0 – 0.1
48PIN QFP (PLASTIC)
36
25
37
24
+ 0.1
0.15 – 0.05
0.15
CXA2074Q/S
48
13
1
0.8
12
+ 0.15
0.3 – 0.1
± 0.12 M
+ 0.35
2.2 – 0.15
+ 0.2
0.1 – 0.1
CXA2074S
SONY CODE
EIAJ CODE
JEDEC CODE
QFP-48P-L04
∗QFP048-P-1212-B
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
EPOXY RESIN
SOLDER / PALLADIUM
PLATING
COPPER / 42 ALLOY
PACKAGE WEIGHT
0.7g
42PIN SDIP (PLASTIC) 600mil
+ 0.4
37.8 – 0.1
42
22
0° to 15°
1
21
1.778 ± 0.25
SONY CODE
EIAJ CODE
JEDEC CODE
0.5 ± 0.1
0.9 ± 0.15
SDIP-42P-02
SDIP042-P-0600-A
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE WEIGHT
EPOXY RESIN
SOLDER PLATING
COPPER / 42 ALLOY
4.4g
– 38 –
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