CXP86217 Ver la hoja de datos (PDF) - Sony Semiconductor

Número de pieza

componentes Descripción

Fabricante

CXP86217

CMOS 8-bit Single Chip Microcomputer

Sony Semiconductor 

Package Outline

Unit: mm

CXP86213/86217, CXP86325/86333, CXP86441/86449/86461

52PIN SDIP (PLASTIC)

+ 0.4

47.0 – 0.1

52

27

0° to 15°

1

26

1.778

0.5 ± 0.1

+ 0.1

0.9 – 0.05

SONY CODE

EIAJ CODE

JEDEC CODE

SDIP-52P-01

SDIP052-P-0600

PACKAGE STRUCTURE

PACKAGE MATERIAL

LEAD TREATMENT

LEAD MATERIAL

PACKAGE MASS

EPOXY RESIN

SOLDER/PALLADIUM

PLATING

COPPER ALLOY

5.6g

NOTE : PALLADIUM PLATING

This product uses S-PdPPF (Sony Spec.-Palladium Pre-Plated Lead Frame).

– 21 –

Share Link: