IRFZ34NS/LPBF
Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
Parameter
V(BR)DSS Drain-to-Source Breakdown Voltage
∆V(BR)DSS/∆TJ Breakdown Voltage Temp. Coefficient
RDS(ON)
VGS(th)
gfs
Static Drain-to-Source On-Resistance
Gate Threshold Voltage
Forward Transconductance
IDSS
Drain-to-Source Leakage Current
IGSS
Qg
Qgs
Qgd
td(on)
tr
td(off)
tf
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
Total Gate Charge
Gate-to-Source Charge
Gate-to-Drain ("Miller") Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
LS
Internal Source Inductance
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
Min. Typ. Max. Units
Conditions
55 V VGS = 0V, ID = 250µA
0.052 V/°C Reference to 25°C, ID = 1mA
0.040 Ω VGS = 10V, ID = 16A
2.0 4.0 V VDS = VGS, ID = 250µA
6.5 S VDS = 25V, ID = 16A
25 µA VDS = 55V, VGS = 0V
250
VDS = 44V, VGS = 0V, TJ = 150°C
100 n A VGS = 20V
-100
VGS = -20V
34
6.8
ID = 16A
nC VDS = 44V
14
7.0
VGS = 10V, See Fig. 6 and 13
VDD = 28V
49 ns ID = 16A
31
RG = 18Ω
40
7.5 nH
RD = 1.8Ω, See Fig. 10
Between lead,
and center of die contact
700
VGS = 0V
240 pF VDS = 25V
100
= 1.0MHz, See Fig. 5
Source-Drain Ratings and Characteristics
Parameter
IS
Continuous Source Current
(Body Diode)
I SM
Pulsed Source Current
(Body Diode)
VSD
Diode Forward Voltage
trr
Reverse Recovery Time
Qrr
Reverse RecoveryCharge
ton
Forward Turn-On Time
Min. Typ. Max. Units
Conditions
29
100
1.6
57 86
130 200
MOSFET symbol
D
showing the
A integral reverse
G
p-n junction diode.
S
V TJ = 25°C, IS = 16A, VGS = 0V
ns TJ = 25°C, IF = 16A
nC di/dt = 100A/µs
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)
Notes:
Repetitive rating; pulse width limited by
max. junction temperature. ( See fig. 11 )
VDD = 25V, starting TJ = 25°C, L = 610µH
RG = 25Ω, IAS = 16A. (See Figure 12)
ISD ≤ 16 A, di/dt ≤ 420A/µs, VDD ≤ V(BR)DSS,
TJ ≤ 175°C
Pulse width ≤ 300µs; duty cycle ≤ 2%.
Uses IRFZ34N data and test conditions
2014-8-26
2
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