KBPC25005 THRU KBPC2510
Reverse Voltage - 50 to 1000 Volts Forward Current -25.0 Amperes
SILICON BRIDGE RECTIFIERS
Features
The plastic package carries Underwriters Laboratory
Flammability Classification 94V-0
Ideal for printed circuit boards
Low reverse leakage
High forward surge current capability
High temperature soldering guaranteed:
260°C/10 seconds,5 lbs. (2.3kg) tension
KBPC-25
1.181(30.0)
1.102(28.0)
0.673(17.1)
0.633(16.1)
.452 MAX.
(11.5)
0.480(12.2)
0.425(10.8)
HOLE FOR
NO.8 SCREW
Mechanical Data
Case : JEDEC KBPC-25 Molded plastic body
Terminals : Solder plated, solderable per MIL-STD-750,Method 2026
Polarity : Polarity symbol marking on body
Mounting Position : Any
Weight : 1.02 ounce, 29 grams
0.732(18.6)
0.692(17.6)
AC
+
-
AC
1.181(30.0)
1.102(28.0)
0.673(17.1)
0.633(16.1)
0.582(14.8)
0.543(13.8)
0.033x0.250
(0.8x6.4)
Dimensions in inches and (millimeters)
Maximum Ratings And Electrical Characteristics
Ratings at 25°C ambient temperature unless otherwisespecified.
Single phase half-wave 60Hz,resistive or inductive load,for capacitive load current derate by 20%.
Parameter
Marking Code
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward
output rectified current at TC=55°C ( N o t e 1 )
SYMBOLS
VRRM
VRMS
VDC
KBPC
25005
MDD
KBPC
25005
50
30
50
KBPC
2501
MDD
KBPC
2501
100
70
100
KBPC
2502
MDD
KBPC
2502
200
140
200
KBPC
2504
MDD
KBPC
2504
400
280
400
KBPC
2506
MDD
KBPC
2506
600
420
600
KBPC
2508
MDD
KBPC
2508
800
560
800
KBPC
2510
MDD
KBPC
2510
1000
700
1000
I(AV)
25.0
UNITS
V
V
V
A
Peak forward surge current
8.3ms single half sine-wave superimposed
on rated load (JEDEC Method)
Rating for Fusing(t<8.3ms)
Maximum instantaneous forward voltage
drop per birdge element at 12.5A
Maximum DC reverse current TA=25°C
at rated DC blocking voltage TA=100°C
Isolation voltage from case to leads
Typical Thermal Resistance (Note 2)
Operating junction temperature range
storage temperature range
IFSM
I2t
VF
IR
VIOS
RθJA
TJ
TSTG
300
373
1.0
10
1.0
2500
2.0
-65 to +125
-65 to +150
NOTES:
1.Unit mounted on 5” x 4” x3” thick(12.8cmx10.2cmx7.3cmcm)Al.plate.
2.Bolt dowm on heat-sink with silicone thermal compound between bridge and mounting surface for
maximum heat transfer efficiency with #8 screw.
A
A2s
V
μA
mA
VAC
°C/W
°C
°C
DN:T19814A0
https://www.microdiode.com
Rev:2019A0
Page :1