BUW13AF Ver la hoja de datos (PDF) - Philips Electronics
Número de pieza
componentes Descripción
Fabricante
BUW13AF Datasheet PDF : 16 Pages
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Philips Semiconductors
Silicon diffused power transistors
Product specification
BUW13F; BUW13AF
PACKAGE OUTLINE
Plastic single-ended package; heatsink mounted; 1 mounting hole; 3 leads (in-line)
SOT199
E
E1
m
P
q
D
A
A1
α
L1
b1
L
1
2
3
e
b
e1
wM
Q
c
0
5 10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT A A1 b b1 c
D
E E1 e
e1
L L1(1) m
P
Q
q
w
α
mm
5.2
4.8
3.4
3.0
1.2
1.0
2.1
1.9
0.6
0.5
21.5 15.3 7.8
20.5 14.7 6.8
5.45
10.9
16.5
15.7
3.7
3.3
0.8
0.6
3.3
3.1
2.1
1.9
6.2
5.8
0.4
45°
Note
1. Terminals in this zone are not tinned.
OUTLINE
VERSION
IEC
REFERENCES
JEDEC
EIAJ
EUROPEAN
PROJECTION
SOT199
ISSUE DATE
97-06-27
1997 Aug 13
11
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