128Mb: x4, x8, x16 Automotive SDRAM
Package Dimensions
Figure 8: 60-Ball TFBGA (x8 Device), 8mm x 16mm – Package Code FB/BB
60X Ø0.45
Dimensions apply
to solder balls
post-reflow on Ø0.33
NSMD ball pads.
87
16 ±0.1
11.2 CTR
0.8 TYP
Seating
plane
A
0.12 A
Ball A1 ID
21
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
Ball A1 ID
0.8 TYP
1.1 ±0.1
5.6 CTR
0.25 MIN
8 ±0.1
Notes: 1. All dimensions are in millimeters.
2. Recommended pad size for PCB is 0.33mm ±0.025mm.
3. Topside part-marking decoder is available at www.micron.com/decoder.
PDF: 09005aef84baf515
128mb_x4x8x16_ait-aat_sdram.pdf - Rev. C 1/14 EN
16
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© 1999 Micron Technology, Inc. All rights reserved.