MT48LC8M16A2P Ver la hoja de datos (PDF) - Micron Technology

Número de pieza

componentes Descripción

Fabricante

MT48LC8M16A2P

Automotive SDR SDRAM

Micron Technology 

128Mb: x4, x8, x16 Automotive SDRAM

Package Dimensions

Figure 9: 54-Ball VFBGA (x16 Device), 8mm x 8mm – Package Code F4/B4

0.65 ±0.05

Seating plane

C

0.12 C

54X Ø0.45 ±0.05

Solder ball

diameter refers

to post reflow

condition. The pre-

reflow diameter

is 0.42.

Ball A9

6.40

3.20

6.40

0.80

TYP

Ball A1 ID

Solder ball material:

62% Sn, 36% Pb, 2% Ag or

96.5% Sn, 3% Ag, 0.5% Cu

Solder mask defined ball pads:

Ø0.40

Substrate material: Plastic laminate

Mold compound: Epoxy novolac

Ball A1 ID

Ball A1

4.00 ±0.05

CL

8.00 ±0.10

0.80 TYP

CL

3.20

4.00 ±0.05

8.00 ±0.10

1.00 MAX

Notes: 1. All dimensions are in millimeters.

2. Recommended pad size for PCB is 0.40mm SMD.

3. Topside part-marking decoder is available at www.micron.com/decoder.

PDF: 09005aef84baf515

128mb_x4x8x16_ait-aat_sdram.pdf - Rev. C 1/14 EN

17

Micron Technology, Inc. reserves the right to change products or specifications without notice.

© 1999 Micron Technology, Inc. All rights reserved.

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