CXD3003R Ver la hoja de datos (PDF) - Sony Semiconductor

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componentes Descripción

Fabricante

CXD3003R

CD Digital Signal Processor with Built-in Digital Servo and DAC

Sony Semiconductor 

Package Outline

Unit: mm

108

109

144PIN LQFP(PLASTIC)

22.0 ± 0.2

20.0 ± 0.1

73

72

1.7 MAX

B

144

1

0.5

0.22 ± 0.05

37

36

0.1 M S

0.1 ± 0.05

0.22 ± 0.05

(0.2)

A

0.1 S

S

0° to 10°

DETAIL A

DETAIL B

SONY CODE

EIAJ CODE

JEDEC CODE

LQFP-144P-L022

LQFP144-P-2020

PACKAGE STRUCTURE

PACKAGE MATERIAL EPOXY RESIN

LEAD TREATMENT

SOLDER PLATING

LEAD MATERIAL

42 / COPPER ALLOY

PACKAGE MASS

1.3g

108

109

144PIN LQFP(PLASTIC)

22.0 ± 0.2

20.0 ± 0.1

73

72

1.7 MAX

1.4 ± 0.1

0.1

144

1

0.5

0.22 ± 0.05

37

36

0.08 M

B

A

0.1 ± 0.05

0.22 ± 0.05

(0.2)

0° to 10°

DETAIL A

SONY CODE

EIAJ CODE

JEDEC CODE

DETAIL B

LQFP-144P-L051

LQFP144-P-2020

PACKAGE STRUCTURE

PACKAGE MATERIAL EPOXY RESIN

LEAD TREATMENT

SOLDER PLATING

LEAD MATERIAL

COPPER ALLOY

PACKAGE MASS

1.3g

– 137 –

CXD3003R

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