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STPS1L30U Ver la hoja de datos (PDF) - STMicroelectronics

Número de pieza
componentes Descripción
Fabricante
STPS1L30U
ST-Microelectronics
STMicroelectronics 
STPS1L30U Datasheet PDF : 12 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
STPS1L30
Characteristics (curves)
Figure 11. Thermal resistance junction to ambient versus copper surface under each lead (SMA)
Rth(j-a) (°C/W)
200
Epoxy printed circuit board FR4, copper thickness: 35 µm
SMA
150
100
50
S(Cu)(cm²)
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
DS1243 - Rev 7
page 5/12

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