NXP Semiconductors
BUK98150-55A
N-channel TrenchMOS logic level FET
5. Thermal characteristics
Table 4:
Symbol
Rth(j-a)
Rth(j-sp)
Thermal characteristics
Parameter
thermal resistance from junction to ambient
thermal resistance from junction to solder point
Conditions
Min Typ Max Unit
-
70 -
K/W
-
-
15 K/W
102
Zth(j-sp)
(K/W)
10 δ = 0.5
003aab529
0.2
0.1
1 0.05
0.02
10-1
P
tp
δ=
T
single shot
tp
t
10-2
10-6
10-5
10-4
10-3
10-2
T
10-1
tp (s)
1
Fig 4. Transient thermal impedance from junction to solder point as a function of pulse duration
BUK98150-55A_4
Product data sheet
Rev. 04 — 11 June 2007
© NXP B.V. 2007. All rights reserved.
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